Mee-inc.com Website Review

data-cycle-prev=.carousel-control.left data-cycle-next=.carousel-control.right style=position: relative;. practical solutions to materials problems through technology and innovation. our engineers and scientists have a wide range of experience. the mee laboratory studies composition, microstructure, and mechanical properties using a wide variety of techniques, including light microscopy, scanning electron microscopy, electrochemical testing, chemical surface an*lysis methods, and mechanical tests. the mee technical staff specializes in comprehensive, root-cause failure an*lysis. the range of experience encompas*es many types of material behavior and modes of failure, including mechanical and corrosion mechanisms, in a wide variety of metals and polymers. whether you are a designer of implantable medical devices, a manufacturer of electronic parts, or an engineer at a steel foundry, your projects benefit from mee’s breadth of scientific expertise, responsiveness, thorough an*lysis and collaborative work style. a fire occurred inside a three-story stainless steel chamber for capturing airborne particulates. to determine the extent of damage to the stainless steel material, an investigation was carried out to characterize the condition of the wall and ceiling materials. several printed circuit boards had failed in testing and were suspected to be cracked. this case study details the failure of five threaded rods from a support system within a high-temperature furnace. the furnace operated at approximately 1250°f, and the rod material was type 310 stainless steel. the objective of the evaluation was to determine the failure mee staff captures thousands of images each year using various light microscopes and scanning electron microscopes. most are taken for specific projects - some for the fun of it - all offer fascinating views of the microscopic world we explore daily at mee. learn about some of our most interesting projects, view fun sem images and stay up-to-date on events we'll be hosting.